TEMD6200fx01 www.vishay.com vishay semiconductors rev. 1.5, 08-apr-14 1 document number: 81812 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ambient light sensor description TEMD6200fx01 is a high speed and high sensitive pin photodiode in a miniature flat plastic package. it is spectral sensitivity is closely matched to the human eye. features ? package type: surface mount ? package form: 0805 ? dimensions (l x w x h in mm): 2 x 1.25 x 0.85 ? radiant sensitive area (in mm 2 ): 0.27 ? aec-q101 qualified ? high photo sensitivity ? adapted to human eye responsivity ? angle of half sensitivity: ? = 60 ? floor life: 168 h, ms l 3, acc. j-std-020 ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 applications ? automotive sensors ? ambient light sensors ? backlight dimming ? mobil phones ? notebooks ? computers note ? test condition see table basic characteristics note ? moq: minimum order quantity product summary component i ra (a) ? (deg) 0.5 (nm) TEMD6200fx01 0.04 60 430 to 610 ordering information ordering code packaging remarks package form TEMD6200fx01 tape and reel moq: 3000 pcs, 3000 pcs/reel 0805 absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 16 v power dissi pation t amb 55 c p v 100 mw junction temperature t j 100 c operating temperature range t amb -40 to +100 c storage temperature range t stg -40 to +100 c soldering temperature in accordance with fig. 6 t sd 260 c thermal resistance junction/ambient r thja 270 k/w
TEMD6200fx01 www.vishay.com vishay semiconductors rev. 1.5, 08-apr-14 2 document number: 81812 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 basic characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - reverse dark current vs. ambient temperature fig. 2 - reverse light current vs. illuminance fig. 3 - diode capacitance vs. reverse voltage fig. 4 - relative spectral sensitivity vs. wavelength basic characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit breakdown voltage i r = 100 a, e = 0 lx v (br) 16 v reverse dark current v r = 10 v, e = 0 lx i ro 0.1 5 na diode capacitance v r = 0 v, f = 1 mhz, e = 0 lx c d 60 pf v r = 5 v, f = 1 mhz, e = 0 lx c d 24 pf reverse light current e e = 1 mw/cm 2 , = 550 nm, v r = 5 v i ra 1a e v = 100 lx, cie illuminant a i ra 0.03 0.04 0.09 a angle of half sensitivity ? 60 deg wavelength of peak sensitivity p 540 nm range of spectral bandwidth 0.5 430 to 610 nm rise time u r = 5 v, r l = 50 , tlmw3300 t r 150 ns fall time u r = 5 v, r l = 50 , tlmw3300 t f 150 ns 0.01 0.1 1 10 100 1000 1 88 1 8 0204060 8 0 100 t am b - am b ient temperat u re (c) i ro - re v erse dark c u rrent (na) v r = 5 v 20093 0.001 0.01 0.1 1 10 10 100 1000 10000 e v - ill u minance (lx) i ra - photoc u rrent (a) cie ill u minant a v r = 5 v 20094 0 10 20 30 40 50 60 70 0102030 v r - re v erse voltage (v) c d - diode capacitance (pf) e 0 = 0 f = 1 mhz 0.0 0.2 0.4 0.6 0. 8 1.0 400 600 8 00 1000 w a v elength (nm) relati v e spectral sensiti v ity photodiode h u man eye 20047
TEMD6200fx01 www.vishay.com vishay semiconductors rev. 1.5, 08-apr-14 3 document number: 81812 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 5 - relative radiant sensitivity vs. angular displacement solder profile fig. 6 - lead (pb)-free reflow solder profile acc. j-std-020 drypack devices are packed in moistu re barrier bags (mbb) to prevent the products from mo isture absorption during transportation and storage. each bag contains a desiccant. floor life time between soldering and re moving from mbb must not exceed the time indicated in j-std-020: moisture sensitivity: level 3 floor life: 168 h conditions: t amb < 30 c, rh < 60 % drying in case of moisture absorpt ion devices should be baked before soldering. conditions see j-std-020 or label. devices taped on reel dry us ing recommended conditions: 192 h at 40 c (+ 5 c), rh < 5 % or 96 h at 60 c (+ 5 c), rh < 5 %. 0.4 0.2 0 s rel - relati v e sensiti v ity 94 8 31 8 0.6 0.9 0. 8 0 30 10 20 40 50 60 70 8 0 0.7 1.0 ? - ang u lar displacement 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperat u re (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp u p 3 c/s max. ramp do w n 6 c/s 19 8 41 255 c
TEMD6200fx01 www.vishay.com vishay semiconductors rev. 1.5, 08-apr-14 4 document number: 81812 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters blister tape dimensions in millimeters 2001 8 21501
TEMD6200fx01 www.vishay.com vishay semiconductors rev. 1.5, 08-apr-14 5 document number: 81812 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 reel dimensions in millimeters of the wheel i s s upplier s pecific. form of the leave open i ss ue: 2; 26.04.10 drawing-no.: 9.800-5096.01-4 s pecification s according to din technical drawing s ? 177.8 max. ? 55 min. 8.4 +2.5 8.4 +0.15 14.4 max. ? 13 + 0.5 - 0.2 1.5 min. ? 20.2 min. z z 2:1 20875
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